The event will be hosted by ICFO, and sponsored by SILVER PIXAPP, InPulse BRONZE OptoSigma, Aurea Technology. The world is going through a quantum revolution. The purpose of the EPIC World Industrial Quantum Photonics Technology Summit is to bring together the companies in the supply chain towards the commercialization of upcoming products resulting from the current R&D initiatives. The keynotes already confirmed are Zeiss, Robert Bosch, Thales, Id Quantique, Oxford HighQ, Single Quantum, Swabian Instruments, Toshiba Research, VLC Photonics, VTT, ESA, Lake Diamond, Quside and Quandela.
EPIC Executive Meeting on Industrial Lasers hosted by Coherent
The EPIC Executive Meeting on Industrial Lasers will focus on a discussion between suppliers and users the latest advances in laser-enabled high precision industrial manufacturing processes. The broad range of applications will cover heavy manufacturing (profile cutting in sheet and plate metals, welding, drilling), light micromachining (profile cutting in plastics and wood, CVD diamond cutting, ceramic and glass micromachining, engraving, marking), manufacturing of electronics (high quality wire stripping, IC repair), and more. The technological capabilities of lasers manufacturers and their full value chain will be showcased and leveraged against the market driven demands. Different types of lasers will be presented by leading manufacturers: CO2 and CO, solid state, excimer lasers, diode and fiber lasers, short pulse, ion lasers, structured light lasers, tunable lasers, as well as the components needed for the laser system assembly (ultrafast amplifiers, oscillators, beam shutters) and techniques such as beam guiding or focusing.
EPIC Meeting on Automation Tools for Packaging and Testing hosted by ASM AMICRA
The purpose of the EPIC Meeting on Automation Tools for Packaging and Testing is to bring together equipment manufacturers and companies investing or interested in the further automation of their high precision manufacturing and testing lines, to discuss the production of optoelectronic components and modules (Silicon Photonics, PICs, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP) and to identify bottlenecks in process automation for any industry (HPLD manufacturing, fiber-optics and opto-electronics, medical technology, security and military applications, telecommunications, R&D, and others) and volume demand.